Precision Engineering · Empowering IC Packaging
Nantong Guo Shang Pte Ltd delivers sub-micron encapsulation molds and progressive trim & form tooling systems powered by ultra-precision grinding workshops and advanced engineering capabilities.
About Guo Shang Precision
Diligence & Efficiency · Creating Value for Partners
Founded in 2012, Nantong Guo Shang Pte Ltd has dedicated over a decade to the semiconductor assembly and test (OSAT) industry as a high-tech enterprise with modern manufacturing facilities, mold design, fine machining, and trial tuning.
Located at No. 1 Tongze Road in Nantong National ETDZ, our state-of-the-art facility is equipped with Japanese OKAMOTO surface grinders, WASINO optical profile grinders (PG), SODICK Wire EDM, and Swiss CHARMILES sink EDM, delivering world-class quality and competitive pricing.
Modern Manufacturing Facility
Located at No. 1 Tongze Road, Nantong ETDZ, featuring climate-controlled cleanrooms for sub-micron tooling accuracy.
Sub-Micron Tolerance
Achieving 0.001mm surface flatness and parallelism control across our precision grinding workshops.
Rapid Response Support
Professional engineering team providing official email engineering assessment and emergency mold maintenance to ensure client uptime.
Semiconductor Tooling Architecture
Sub-micron semiconductor packaging molds & progressive trim & form tooling systems conforming to OSAT manufacturing standards
Auto Mold Systems
Auto Encapsulation Mold Chase & Cavity Bar Systems
Integrated mold chase & precision cavity bars for QFN, DFN, SOP, DIP, and BGA packages with 0.001mm concentricity and <0.1% void rate.
Trim & Form Systems
Progressive Trim & Form Tooling Systems
Multi-station progressive dies for IC leadframe lead trimming, dambar removal, and gull-wing/J-lead forming with burr < 0.005mm.
Auto Mold Systems
Ejector Pins, Pots, Plungers & Pot Inserts
Manufactured from Swedish ASSAB steel & Japanese carbide ground on WASINO PG grinders with PVD coating to prevent seizing.
Grinding Workshop & Inspection
World-class precision grinding machinery guaranteeing sub-micron level quality
OKAMOTO Surface Grinders
Japanese Okamoto precision surface grinders achieving mirror lapping for ultimate plate flatness.
Flatness 0.001mm/300mmWASINO Optical Grinders (PG)
Japanese Wasino optical profile grinders for mirror-lapping carbide punch cutting edges.
Grinding Tol. 0.001mmSODICK Wire Cut EDM
Japanese Sodick ultra-precision wire cutting machines ensuring perfect verticality on complex punch profiles.
Machining Acc. 0.001mmCHARMILES / SODICK Sink EDM
Top-tier Swiss Charmiles and Japanese Sodick EDM machines providing mirror-finish spark erosion for narrow slots.
Corner Radius R0.01mmTESA Micro-Hite Gauge
Swiss TESA 1D/2D high-accuracy height gauge monitoring component step dimensions in real time.
Resolution 0.0001mmOGP Optical Measuring System
US OGP non-contact multi-sensor optical video system for automated 3D dimensional verification.
100% Full InspectionStrict Full-Process Quality Control
In semiconductor packaging, a single micron deviation can compromise millions of IC chips. We adhere to rigorous quality standards.
-
01Incoming Material Inspection (IQC)
Selecting imported ASSAB (Sweden) and DAIDO (Japan) steel and carbide with full metallographic certificates per batch.
-
02Grinding & In-Process QA (IPQC)
Mandatory 3-step first-piece verification across precision grinding, EDM, and Wire EDM using height gauges.
-
03Trial Press & Outgoing QA (OQC)
Dedicated trial presses and optical dimension checks prior to shipment, ensuring seamless client production deployment.
Valued Partners & Industry Leaders
Guo Shang precision molds and tooling systems proudly serve Fujitsu Semiconductor, Jiangyin JCET Group, Lite-On Technology, and global semiconductor leaders.
Contact Us · Inquiries & Support
Nantong Guo Shang Pte Ltd
南通国尚精密机械有限公司
Specializing in semiconductor packaging molds, trim & form systems, and sub-micron custom precision components.